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Issue Date Title Author(s) Journal View
2015
Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization

Choi, Sang Kyung ;  Kim, Han Gil ;  Kim, Jun Beam ;  Cheon, Tae Hoon ;  Seo, Jong Hyun ;  Kim, Soo Hyun

Elsevier, 2015

 553
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